Price:
US$5.56

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BGA Stencil Communication Baseband Module BGA Reballing Stencil Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

Compatibility

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                  Features:

                  3D laser square hole BGA reballing stencil template.
                  High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
                  New patented iphone X Middle Layer Motherboard  for iPhone X Middle layer motherboard.
                  Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
                   
                  Specification:

                  Type: for iPHone 5/5S / for iPHone 6 / for iPHone 6S / for iPHone 7 / for iPHone 8

                   
                  Package included:

                  1 x BGA Reballing Tool

                   
                  Details pictures:

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