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KAISI 3D IC Chip BGA Reballing Stencil Kits A8 A9 A10 A11 A12 Stencil Tin Planting Net Hand Tools for iPhone 6/6 Plus 6S/6S Plus 7/7 Plus 8/X XS/XR

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                  Features:
                   
                  This 3D BGA reball stencils can location the IC chip when you repair, it's so convenient, stable and accurately.
                  No need IC holder station.

                  Type: 

                  A: A8: Suitable for iPhone 6/6 plus 
                  B: A9: Suitable for iPhone 6S/6S Plus
                  C: A10: Suitable for iPhone 7/7 plus
                  D: A11: Suitable for iPhone 8/X
                  E: A12: Suitable for iPhone XS/XR
                   
                  Notice:
                   
                  1.The package don't include any IC.
                  2. Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same. 

                  Package Included: 
                   
                  1x A8/A9/A10/A11 Set 3D BGA Reball Stencils

                  Detail Pictures:

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